Device for processing substrate

专利名称：Device for processing substrate发明人：廣野 嘉文申请号：JP2018169092申请日：20180910公开号：JP2018192622A公开日：20181206

专利附图：

摘要：Problem to be solved: to replace the tool without reducing the operating rateof the device in the substrate processing apparatus. The apparatus comprises a transportmechanism 2 for transporting a substrate, first and second guide frames 3a and 4a, firstand second machining heads 5 and 6, and a table 7. The first and second guide frames 3a

and 4A extend in the conveying direction on both sides of the conveying mechanism 2.The first and second machining heads 5 and 6 are supported by the first and secondguide frames 3a and 4a and are movable along the conveying direction above theconveying mechanism 2.The table 7 can be moved between the carry in \\/ out area on thetransport mechanism 2, the first working area and the second processing region. The firstworking region and the second working area are opposed to the carry in \\/ transportregion with the first and second guide frames 4A interposed therebetween. A portion ofeach guide frame located in the processing region is made of stone, and the portion ofthe guide frame located in the standby region where the processing region is removed ismade of metal. Diagram

申请人：三星ダイヤモンド工業株式会社

地址：大阪府摂津市香露園３２番１２号

国籍：JP

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