专利名称：Device for processing substrate发明人：谷垣内 平道,中田 勝喜申请号：JP2017191502申请日：20170929公开号：JP2019064118A公开日：20190425
专利附图：
摘要：Problem to be solved: to provide a substrate processing apparatus capable ofsupporting and accurately supporting the substrate without damaging the substrate.Thesubstrate processing apparatus comprises a belt 11 for transporting a brittle materialsubstrate, and a clamping device 40 for clamping a brittle material substrate mounted on
the belt 11.The clamping device 40 comprises a substrate support portion 51 forsupporting a brittle material substrate from below and an arm 57 which is rotated ormoved relative to the substrate support part 51 and sandwiches the brittle materialsubstrate between the substrate support part 51 and the substrate support part Asurface contacting the brittle material substrate is made of an elastic material, and thesurface of the substrate support at least contacting the brittle material substrate ismade of metal.Diagram
申请人：三星ダイヤモンド工業株式会社
地址：大阪府摂津市香露園３２番１２号
国籍：JP
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