Device for processing substrate

专利名称：Device for processing substrate发明人：Mitsunori Nakamori,Hiroki

Taniyama,Takanori Miyazaki

申请号：US09725951申请日：20001130公开号：US06589338B1公开日：20030708

专利附图：

摘要：This substrate processing device is identical to a wafer cleaning device forcleaning a wafer W, which includes a supply nozzle for supplying APM and the pure water,a spin chuck for carrying the wafer W and a container for accommodating the spin chuck .

The container includes an inner processing chamber and an outer processing chamberand is constructed so as to be movable up and down to the spin chuck . A first drainageline is connected to the inner processing chamber to discharge APM and the interioratmosphere, while a second drainage line is connected to the outer processing chamberto discharge pure water and the interior atmosphere. With the connection of the firstdrainage line , the wafer cleaning device is adapted so that the supply nozzle suppliesAPM to a surface of the wafer W again. Therefore, it is possible to reuse this processingliquid advantageously and additionally, an exhaust displacement can be reduced.

申请人：TOKYO ELECTRON LIMITED

代理机构：Smith, Gambrell & Russell, LLP

更多信息请下载全文后查看